With a consistent Compound Annual Growth Rate (CAGR) of 4.0%, the Radiation Hardened Electronics Market is expected to rise from USD 1.5 billion in 2022 to USD 1.8 billion by 2027. The need for parts like Mixed Signal ICs, Processors & Controllers, Memory, and Power Management—which are especially made to survive radiation exposure in demanding environments—is what is fueling this expansion. The resistance of these devices is greatly increased by manufacturing methods such as Radiation Hardened by Design (RHBD) and Radiation Hardened by Process (RHBP). Diverse application domains, such as space exploration, defence, and aerospace, where dependable and robust electronics in radiation-prone environments are critical, have a significant impact on the market's trajectory. The Radiation Hardened Electronics Market is poised to become increasingly important in maintaining the integrity and operation of electronic systems in radiation-intensive settings as long as technological breakthroughs persist.
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The Radiation Hardened Electronics Market is expanding rapidly due to ongoing technological developments in multicore processors made especially for space- and military-grade applications. Electronic systems that can endure harsh nuclear environments are in greater demand on the market; these systems are essential for the aerospace and defence industries. The market's growth is further aided by the increased attention being paid to intelligence, surveillance, and reconnaissance (ISR) operations throughout the world. The Radiation Hardened Electronics Market is positioned to face the difficulties offered by developing technology and shifting defence requirements as the necessity for robust and resilient electronics in these harsh environments grows.
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Power electronics component to hold the largest size of radiation hardened electronics market during the forecast period
It is projected that the radiation-hardened electronics market will be dominated by the power electronics component segment, which will continue to have a bigger market share during the projected period. Due in large part to its exceptional resistance to ionising radiation and high-energy charged particles, Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) power electronics are becoming more and more popular in space and high-reliability applications. The performance of MOSFET devices for space applications is being constantly enhanced by manufacturers; for example, IR HiRel provides advanced Si MOSFET devices that lower the cost per bit and increase system efficiency in satellite high-throughput settings. The R9 MOSFET helps satellite designers achieve optimal performance with its improved current capability and compatibility with various gate drivers.
COTS in product type segment is expected to grow at the fastest CAGR during the forecast period
The radiation-hardened electronics market is expected to be dominated by the commercial-off-the-shelf (COTS) segment, which is expected to grow at the fastest rate (CAGR) over the projected period. The rapid expansion of the COTS product category has been largely fueled by the spread of affordable nanosatellites. The enhanced use of COTS in military space missions can be attributed to its attractive signal processing designs. Notably, COTS is an attractive alternative for reducing costs in space applications because these components may be readily substituted with ceramic packages that are pin-out compliant and provide identical functionality to the original devices. Because of the significant cost reductions, risk reduction, and development time reduction that it offers, COTS is the recommended option for radiation-hardened electronics.
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North America expected to dominate the radiation hardened market during the forecast period
Over the course of the forecast period, the radiation-hardened electronics market is expected to be dominated by the North American region. The growing need for radiation-hardened components, especially for military and commercial satellite applications, is driving this dominance. Dependable radiation-hardened microelectronics are becoming more and more necessary for the Department of Defence (DoD) and other commercial sectors in the United States to support vital programmes including satellite deployments and nuclear modernization efforts. The US government has launched programmes to strengthen domestic skills in the production of radiation-hardened microelectronic components because it recognises the sector's strategic relevance. The December 2021 authorization, which utilises the Defence Production Act (DPA) Title III to strengthen and expand the domestic industrial base for radiation-hardened microelectronics, is an example of this commitment.
Key players in the radiation hardened electronics market are Microchip Technology Inc. (US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), Xilinx, Inc. (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US). SMEs/startups covered in the study are Cobham Limited (UK), Analog Devices, Inc (US), Data Devices Corporation (US), 3D Plus (France), Mercury Systems, Inc. (US), PCB Piezotronics, Inc (US), Vorago (US), Micropac Industries, Inc (US), GSI technology, Inc (US), Everspin Technologies Inc (US), Semiconductor Components Industries, LLC (US), AiTech (US), Microelectronics Research Development Corporation (US), Space Micro, Inc (US), and Triad Semiconductor ( US).
News Covered:
https://www.globenewswire.com/en/news-release/2023/01/31/2598365/0/en/Global-Radiation-Hardened-Electronics-Industry-Size-is-Anticipated-to-Gain-1-8-Bn-by-2027-at-a-CAGR-of-4-0.html
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